Composite electronic component and board having the same

ABSTRACT

A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a Continuation of U.S. patent application Ser. No.15/834,863, filed on Dec. 7, 2017, which claims benefit of priority toKorean Patent Application No. 10-2017-0125283 filed on Sep. 27, 2017 inthe Korean Intellectual Property Office, the disclosure of which areincorporated herein by reference in their entirety.

TECHNICAL FIELD

The present disclosure relates to a composite electronic component and aboard having the same.

BACKGROUND

A multilayer ceramic capacitor, a multilayer chip electronic component,is a chip type condenser mounted on the printed circuit boards ofseveral electronic products such as display devices including liquidcrystal displays (LCDs), plasma display panels (PDPs), or the like,computers, personal digital assistants (PDAs), mobile phones, and thelike, serving to charge or discharge electricity.

Such a multilayer ceramic capacitor (MLCC) may be used as a component invarious electronic apparatuses due to advantages such as a small size,high capacitance, and ease of mountability.

The multilayer ceramic capacitor may have a structure in which aplurality of dielectric layers and internal electrodes having differentpolarities are disposed between the dielectric layers and arealternately stacked.

Since the dielectric layer as described above has piezoelectricity andelectrostriction, when a direct current (DC) or alternating current (AC)voltage is applied to the multilayer ceramic capacitor, a piezoelectricphenomenon may occur between the internal electrodes, causingvibrations.

These vibrations may be transferred to a printed circuit board on whichthe multilayer ceramic capacitor is mounted through external electrodesof the multilayer ceramic capacitor, such that an entire printed circuitboard becomes a sound reflecting surface to transmit the sound ofvibrations as noise.

The sound of vibrations may correspond to an audio frequency range of 20Hz to 20,000 Hz, potentially causing user discomfort. The vibrationnoise causing listener discomfort as described above is known asacoustic noise.

In accordance with the recent trend for slimness and miniaturization ofelectronic devices, such a multilayer ceramic capacitor has been usedtogether with a printed circuit board in an environment of high voltageand large voltage change, and thus, the acoustic noise may besufficiently recognized by a user.

Therefore, a novel product capable of decreasing acoustic noise has beencontinuously demanded.

SUMMARY

An aspect of the present disclosure may provide a composite electroniccomponent capable of decreasing acoustic noise, a board having the same.

According to an aspect of the present disclosure, a composite electroniccomponent may include: a composite body in which a multilayer ceramiccapacitor and a ceramic chip are coupled to each other, the multilayerceramic capacitor including a first ceramic body in which a plurality ofdielectric layers and internal electrodes disposed to face each otherwith respective dielectric layers interposed therebetween are stacked,and first and second external electrodes disposed on both end portionsof the first ceramic body; and the ceramic chip including a secondceramic body disposed on a lower portion of the multilayer ceramiccapacitor, and first and second terminal electrodes disposed on both endportions of the second ceramic body and connected to the first andsecond external electrodes. A width of first regions of the secondceramic body in which the first and second terminal electrodes aredisposed is wider than a width of a second region of the second ceramicbody between the first regions.

According to another aspect of the present disclosure, a compositeelectronic component may include: a composite body in which a multilayerceramic capacitor and a ceramic chip are coupled to each other, themultilayer ceramic capacitor including a first ceramic body in which aplurality of dielectric layers and internal electrodes disposed to faceeach other with respective dielectric layers interposed therebetween arestacked, and first and second external electrodes disposed on both endportions of the first ceramic body; and the ceramic chip including asecond ceramic body disposed on a lower portion of the multilayerceramic capacitor, and first and second terminal electrodes disposed onboth end portions of the second ceramic body and connected to the firstand second external electrodes. The ceramic chip has a cut portion cutinwardly from both end portions of the ceramic chip in a lengthdirection, and the first and second terminal electrodes are entirelydisposed on both end portions of the second ceramic body in the lengthdirection.

According to another aspect of the present disclosure, a board having acomposite electronic component may include: a printed circuit board onwhich a plurality of electrode pads are formed; the composite electroniccomponent as described above, mounted on the printed circuit board; anda solder connecting the electrode pads and the composite electroniccomponent to each other.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view schematically illustrating a compositeelectronic component according to an exemplary embodiment in the presentdisclosure;

FIG. 2 is a top plan view of the composite electronic component of FIG.1;

FIG. 3 is an exploded perspective view separately illustrating amultilayer ceramic capacitor and a ceramic chip of the compositeelectronic component of FIG. 1;

FIG. 4 is an exploded perspective view separately illustrating amultilayer ceramic capacitor and a ceramic chip of another example ofthe composite electronic component of FIG. 1;

FIG. 5 is a partially cut-away perspective view schematicallyillustrating the multilayer ceramic capacitor of the compositeelectronic component of FIG. 1;

FIG. 6 is a front view illustrating the composite electronic componentaccording to the exemplary embodiment in the present disclosure;

FIG. 7 is a perspective view schematically illustrating a compositeelectronic component according to another exemplary embodiment in thepresent disclosure;

FIG. 8 is a perspective view illustrating a board in which the compositeelectronic component of FIG. 1 is mounted on a printed circuit board;and

FIG. 9 is a cross-sectional view illustrating the board in which thecomposite electronic component of FIG. 8 is mounted on the printedcircuit board, taken in a length direction.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present disclosure will now bedescribed in detail with reference to the accompanying drawings.

Composite Electronic Component

FIG. 1 is a perspective view schematically illustrating a compositeelectronic component according to an exemplary embodiment in the presentdisclosure.

FIG. 2 is a top plan view of the composite electronic component of FIG.1.

Referring to FIG. 1, in the composite electronic component according tothe exemplary embodiment in the present disclosure, a ‘length direction’refers to an ‘L’ direction of FIG. 1, a ‘width direction’ refers to a‘W’ direction of FIG. 1, and a ‘thickness direction’ refers to a ‘T’direction of FIG. 1. Here, the ‘thickness direction’ may be the same asa direction in which dielectric layers of a capacitor are stacked, thatis, a ‘stacking direction’.

Meanwhile, in the exemplary embodiment in the present disclosure, thecomposite electronic component may have upper and lower surfacesopposing each other in the thickness direction, first and second endsurfaces in the length direction and third and fourth side surfaces inthe width direction that connect the upper and lower surfaces to eachother. A shape of the composite electronic component is not particularlylimited, but may be a hexahedral shape as illustrated.

In addition, the first and second end surfaces of the compositeelectronic component in the length direction and the third and fourthside surfaces thereof in the width direction may be defined as surfacesin the same directions as directions of first and second end surfaces ofthe multilayer ceramic capacitor and the ceramic chip in the lengthdirection and third and fourth side surfaces of the multilayer ceramiccapacitor and the ceramic chip in the width direction, respectively, asdescribed below.

Meanwhile, in the composite electronic component, the multilayer ceramiccapacitor and the ceramic chip may be coupled to each other, and in acase in which the ceramic chip is coupled to a lower portion of themultilayer ceramic capacitor, the upper surface of the compositeelectronic component may be defined as an upper surface of themultilayer ceramic capacitor, and a lower surface of the compositeelectronic component may be defined as a lower surface of the ceramicchip.

Referring to FIGS. 1 and 2, the composite electronic component accordingto the exemplary embodiment in the present disclosure may include acomposite body 300 in which a multilayer ceramic capacitor 100 and aceramic chip 200 are coupled to each other. The multilayer ceramiccapacitor 100 includes a first ceramic body 110 in which a plurality ofdielectric layers and internal electrodes disposed to face each otherwith respective dielectric layers interposed therebetween are stackedand first and second external electrodes 131 and 132 disposed on bothend portions of the first ceramic body 110. The ceramic chip 200includes a second ceramic body 210 disposed on a lower portion of themultilayer ceramic capacitor 100 and first and second terminalelectrodes 211 and 212 disposed on both end portions of the secondceramic body 210 and connected to the first and second externalelectrodes 131 and 132.

According to the exemplary embodiment in the present disclosure, acomposite electronic component in which a width W1 of a first region 210a of the second ceramic body 210 in which the first and second terminalelectrodes 211 and 212 are disposed is wider than a width W2 of a secondregion (the other region) 210 b of the second ceramic body 210 may beprovided.

The first region 210 a of the second ceramic body 210 may be defined asregions of the second ceramic body 210 configuring the ceramic chip 200in which the first and second terminal electrodes 211 and 212 aredisposed, and the second region (the other region) 210 b of the secondceramic body 210 may be defined as a central region of the secondceramic body 210 in which the first and second terminal electrodes 211and 212 are not disposed.

Further, the second region (the other region) 210 b of the secondceramic body 210 may be a region corresponding to a central region ofthe first ceramic body 110 configuring the multilayer ceramic capacitor100 in which the first and second external electrodes 131 and 132 arenot disposed.

Meanwhile, the width W1 of the first region 210 a of the second ceramicbody 210 in which the first and second terminal electrodes 211 and 212are disposed may be equal to or almost equal to a width of the firstceramic body 110. Therefore, hereinafter, the width of the first ceramicbody 110 may also be represented by W1.

According to the exemplary embodiment in the present disclosure, sincethe width W1 of the first region 210 a of the second ceramic body 210 inwhich the first and second terminal electrodes 211 and 212 are disposedis wider than the width W2 of the second region (the other region) 210 bof the second ceramic body 210, a central region of the ceramic chip 200in the length direction in which the first and second terminalelectrodes 211 and 212 are not disposed may have a shape cut in thewidth direction.

Further, the width W2 of the second region 210 b of the second ceramicbody 210 maybe narrower than the width of the first ceramic body 110corresponding thereto.

As described above, since the width W1 of the first region 210 a of thesecond ceramic body 210 in which the first and second terminalelectrodes 211 and 212 are disposed is almost equal to a width of thefirst ceramic body 110, the width W2 of the second region 210 b of thesecond ceramic body 210 may be narrower than the width of the firstceramic body 110.

According to the exemplary embodiment of the present disclosure, theceramic chip 200 may have a cut portion 250 cut inwardly from both endportions of the ceramic chip 200 in the length direction.

The cut portion 250 may have a shape cut inwardly from both end portionsof the first region 210 a of the second ceramic body 210 in the lengthdirection in which the first and second terminal electrodes 211 and 212are disposed, and be formed at a predetermined size in central regionsof the second ceramic body 210 in the width direction.

According to the related art, research into a composite electroniccomponent in which a printed circuit board was used on a lower surfaceof a multilayer ceramic capacitor in order to decrease acoustic noisehas been conducted.

However, in a case of increasing a thickness of the printed circuitboard, an effect of decreasing acoustic noise may be increased, but aside effect of decreasing electrical properties may occur. Therefore,research into a technology capable of efficiently decreasing acousticnoise while significantly decreasing the thickness of the printedcircuit board has been required.

In the exemplary embodiment in the present disclosure, the ceramic chip200 may be disposed below the multilayer ceramic capacitor 100 in orderto decrease acoustic noise, but the width W2 of the second region 210 bof the second ceramic body may be narrower than the width of the firstceramic body 110 corresponding thereto, and the ceramic chip 200 mayhave the cut portion 250 cut inwardly from both end portions of thefirst region 210 a of the second ceramic body 210 in the lengthdirection, such that an effect of decreasing acoustic noise may be moreexcellent, as compared to the composite electronic component accordingto the related art in which the printed circuit board is used on a lowersurface of the multilayer ceramic capacitor.

Particularly, the central portion of the second ceramic body 210 coupledto the first ceramic body 110 in the length direction may be cut, andthe cut portion 250 may be further disposed in the central regions ofthe second ceramic body 210 in the width direction in both end portionsof the second ceramic body 210 in the length direction, a step may beformed in the thickness direction, such that the effect of decreasingacoustic noise may be excellent.

That is, the step may be formed in order to form a space capable ofbeing defined as a solder pocket between the multilayer ceramiccapacitor 100 and the ceramic chip 200, and the solder pocket or thestep may block a solder from being formed in the thickness direction ofthe multilayer ceramic capacitor 100, such that the transferring ofvibrations to the printed circuit board by the solder may besignificantly decreased.

In detail, referring to FIG. 2, in the ceramic chip 200, the width W2 ofthe second region 210 b of the second ceramic body 210 may be narrowerthan the width of the first ceramic body 110 corresponding thereto, andthe ceramic chip 200 may have the cut portion 250 cut inwardly from bothend portions of the first region 210 a of the second ceramic body 210 inthe length direction, such that the space capable of being defined asthe solder pocket may be formed.

In this case, at the time of mounting the composite electronic componentaccording to the exemplary embodiment in the present disclosure on aprinted circuit board and applying a solder, the solder may be mostlyfilled in the solder pocket, and the residual solder may be applied ontolower surfaces of the first and second external electrodes 131 and 132of the multilayer ceramic capacitor 100 and side surfaces of the firstand second terminal electrodes 211 and 212 of the ceramic chip 200.

Since an amount of the solder applied onto the lower surfaces of thefirst and second external electrodes 131 and 132 of the multilayerceramic capacitor 100 and the side surfaces of the first and secondterminal electrodes 211 and 212 of the ceramic chip 200 is smaller thanthat in a structure according to the related art, the transferring ofvibrations to the printed circuit board by the solder may besignificantly decreased.

According to the exemplary embodiment in the present disclosure, theceramic chip 200 may be coupled to the lower portion of the multilayerceramic capacitor 100 to thereby be disposed thereon.

In the ceramic chip 200, the first and second terminal electrodes 211and 212 connected to the first and second external electrodes 131 and132 may be disposed on both end portions of the second ceramic body 210formed of bulk shaped ceramic.

In general, in order to significantly decrease the transferring ofvibrations of a multilayer ceramic capacitor to a printed circuit board,there was an attempt to insert an intermediate medium between themultilayer ceramic capacitor and the printed circuit board.

However, since the intermediate medium, which is a resin generally usedto manufacture a board, is formed of a material having elasticity, theintermediate medium may serve to absorb vibrations of the multilayerceramic capacitor through elasticity of the intermediate medium.

On the contrary, according to the exemplary embodiment in the presentdisclosure, since the second ceramic body 210 of the ceramic chip 200 isformed of only hard ceramic material that is not elastically deformed,the printed circuit board and the multilayer ceramic capacitor 100 maybe spaced apart from each other by the ceramic chip 200, therebyblocking vibrations itself generated in the multilayer ceramic capacitor100 from being transferred.

The ceramic may contain alumina (Al₂O₃).

The second ceramic body 210 may be formed of alumina (Al₂O₃), therebysuppressing vibrations itself generated in the multilayer ceramiccapacitor 100 from being transferred.

The first and second terminal electrodes 211 and 212 may have a doublelayer structure composed of first and second conductive resin layers atinner portions thereof and first and second plating layers at outerportions thereof.

According to the exemplary embodiment in the present disclosure, in acase in which the first and second terminal electrodes 211 and 212 havethe double layer structure composed of the first and second conductiveresin layers at inner portions thereof and the first and second platinglayers at outer portions thereof as described above, when mechanicalstress is applied thereto from the outside, the ceramic chip 200 and theconductive resin layers used as the terminal electrodes 211 and 212 ofthe ceramic chip 200 may suppress stress from being transferred to themultilayer ceramic capacitor 100, thereby preventing the multilayerceramic capacitor from being damaged by cracks.

The first and second conductive resin layers may contain a conductivemetal and a thermosetting resin, for example, silver (Ag) and an epoxyresin, but are not limited thereto.

The first and second terminal electrodes 211 and 212 may be entirelydisposed on both end portions of the second ceramic body 210 in thelength direction, such that adhesive force with the external electrodes131 and 132 of the multilayer ceramic capacitor may be improved.

FIG. 3 is an exploded perspective view separately illustrating amultilayer ceramic capacitor and a ceramic chip of the compositeelectronic component of FIG. 1.

In the present exemplary embodiment, the composite body 300 may beformed by coupling the multilayer ceramic capacitor 100 and the ceramicchip 200 to each other, and a method of forming the composite body 300is not particularly limited.

For example, as illustrated in FIG. 3, the composite body 300 may beformed by coupling the multilayer ceramic capacitor 100 and the ceramicchip 200 that are separately manufactured to each other using a highmelting point solder, a conductive adhesive 213, or the like. In a casein which the conductive adhesive 213 is a high melting point solder, themelting point of the conductive adhesive 213 may be higher than amelting point of a solder filling the solder pocket to electricallyconnect the composite body 300 to a mounting board. As such, atemperature greater than the melting point of the solder filling thesolder pocket but lower than the melting point of the conductiveadhesive 213 can be applied at the time of mounting the composite body300 to the mounting board, so as to ensure an electrical connectionbetween the composite body 300 and the mounting board while securing anexisting adhesion between the ceramic capacitor 100 and the ceramic chip200 by the conductive adhesive 213.

The conductive adhesive 213 may be a paste containing a conductive metaland an epoxy resin, but is not necessarily limited thereto.

In a case of coupling the multilayer ceramic capacitor 100 and theceramic chip 200 using the high melting point solder, the conductiveadhesive 213, or the like, the conductive adhesive 213 may be appliedonto the lower surfaces of the first and second external electrodes 131and 132 to thereby be adhered to the first and second terminalelectrodes 211 and 212 of the ceramic chip 200.

The high melting point solder or the conductive adhesive 213 may beapplied onto the lower surfaces of the first and second externalelectrodes 131 and 132 to thereby be fixed to the ceramic chip 200 atthe lower surface of the multilayer ceramic capacitor 100, such thatonly vibrations of a surface (LW surface) of the first ceramic body 110in a length-width direction may be transferred to the ceramic chip 200.

Therefore, the transferring of stress and vibrations generated in themultilayer ceramic capacitor to the ceramic chip may be significantlydecreased, such that acoustic noise may be decreased.

FIG. 4 is an exploded perspective view separately illustrating amultilayer ceramic capacitor and a ceramic chip of another example ofthe composite electronic component of FIG. 1.

Referring to FIG. 4, as another example of the composite electroniccomponent, the multilayer ceramic capacitor 100 and the ceramic chip 200may be coupled to each other by an insulating adhesive 214 appliedbetween the lower surface of the first ceramic body 110 of themultilayer ceramic capacitor and an upper surface of the second ceramicbody 210 of the ceramic chip 200.

Application of the insulating adhesive 214 between the lower surface ofthe first ceramic body 110 of the multilayer ceramic capacitor and theupper surface of the second ceramic body 210 of the ceramic chip 200 maymean that the insulating adhesive 214 is applied to ceramic portions ofthe lower surface of the first ceramic body 110 and the upper surface ofthe second ceramic body 210 on which the first and second externalelectrodes and the first and second terminal electrodes are notdisposed.

The insulating adhesive 214 is not particularly limited, but may be, forexample, an epoxy resin.

Hereinafter, the multilayer ceramic capacitor 100 and the ceramic chip200 configuring the composite body 300 will be described in detail.

FIG. 5 is a partially cut-away perspective view schematicallyillustrating the multilayer ceramic capacitor of the compositeelectronic component of FIG. 1.

Referring to FIG. 5, the first ceramic body 110 configuring themultilayer ceramic capacitor 100 may be formed by stacking a pluralityof dielectric layers 111, and a plurality of internal electrodes 121 and122 (sequentially first and second internal electrodes) may beseparately disposed in the first ceramic body 110 with respectivedielectric layers interposed therebetween.

The plurality of dielectric layers 111 configuring the first ceramicbody 110 may be in a sintered state, and adjacent dielectric layers maybe integrated with each other so that boundaries therebetween are notreadily apparent.

The dielectric layer 111 may be formed by sintering a ceramic greensheet containing ceramic powder, an organic solvent, and an organicbinder. The ceramic powder, which is a material having highpermittivity, may be a barium titanate (BaTiO₃) based material, astrontium titanate (SrTiO₃) based material, or the like, but is notlimited thereto.

That is, the dielectric layers 111 configuring the first ceramic body110 may contain a ferroelectric material, but is not necessarily limitedthereto.

Meanwhile, according to the exemplary embodiment in the presentdisclosure, the internal electrodes may include first internalelectrodes 121 exposed to the first end surface of the composite body300 in the length direction and second internal electrodes 122 exposedto the second end surface thereof in the length direction, but theinternal electrodes are not necessarily limited thereto.

The first and second internal electrodes 121 and 122 may be formed of aconductive paste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), oran alloy thereof, but is not limited thereto.

The first and second internal electrodes 121 and 122 may be printed onthe ceramic green sheets forming the dielectric layers 111, using theconductive paste by a printing method such as screen printing method ora gravure printing method.

The ceramic green sheets on which the internal electrodes are printedmay be alternately stacked and sintered, thereby forming the ceramicbody.

The plurality of first and second internal electrodes 121 and 122 may bedisposed to be perpendicular to the upper and lower surfaces of thefirst ceramic body 110.

That is, the first and second internal electrodes 121 and 122 may bestacked to be perpendicular to a mounting surface of the composite body300 at the time of mounting the composite body 300 on a printed circuitboard.

In general, when a voltage is applied to a multilayer ceramic capacitor,a ceramic body may be repeatedly expanded and contracted in length,width, and thickness directions due to an inverse piezoelectric effectof dielectric layers.

That is, in a case of actually measuring displacement amounts of asurface (LW surface) of the ceramic body in a length-width direction, asurface (WT surface) of the ceramic body in a width-thickness direction,and a surface (LT surface) of the ceramic body in a length-thicknessdirection using a laser doppler vibrometer (LDV), the displacementamount is decreased in a sequence of the LW surface, the WT surface, andthe LT surface.

The displacement amount of the LT surface is about 42% or so, based onthat of the WT surface, such that the displacement amount of the LTsurface may be smaller than that of the WT surface. The reason may bethat stress having the same magnitude is generated in the LT surface andthe WT surface, but particularly, since the LT surface has a relativelywide area as compared to the WT surface, stress having a similarmagnitude may be distributed throughout the wide area, such thatrelatively small deformation may occur.

Therefore, it may be appreciated that in the general multilayer ceramiccapacitor, the displacement amount is the smallest in the LT surface.

That is, according to the exemplary embodiment in the presentdisclosure, the first and second internal electrodes 121 and 122 may bestacked to be perpendicular to the upper and lower surfaces of the firstceramic body 110, such that at the time of mounting the composite body300 on the printed circuit board, the first and second internalelectrodes 121 and 122 may be disposed to be perpendicular to themounting surface, thereby significantly decreasing a vibration amount ofa surface of the first ceramic body 110 coming in contact with theceramic chip 200.

However, a stacking direction of the first and second internalelectrodes 121 and 122 is not limited to a direction perpendicular tothe upper and lower surface of the first ceramic body 110, but the firstand second internal electrodes 121 and 122 may also be stacked in adirection horizontal to the upper and lower surfaces of the first secondbody 110.

Meanwhile, the first and second external electrodes 131 and 132 may beformed of a conductive paste including a conductive metal, wherein theconductive metal may be nickel (Ni), copper (Cu), palladium (Pd), gold(Au), or an alloy thereof, but is not limited thereto.

Further, nickel/tin (Ni/Sn) plating layers may be further disposed onthe first and second external electrodes 131 and 132.

FIG. 6 is a front view illustrating the composite electronic componentaccording to the exemplary embodiment in the present disclosure.

Referring to FIG. 6, in the composite electronic component according tothe exemplary embodiment in the present disclosure, a length L2 of theceramic chip 200 may be shorter than a length L1 of the multilayerceramic capacitor 100.

The length L2 of the ceramic chip 200 may be equal to or greater than0.6 times the length L1 of the multilayer ceramic capacitor 100, and amaximum length of the ceramic chip 200 may be equal to the length L1 ofthe multilayer ceramic capacitor 100.

Since the length L2 of the ceramic chip 200 is shorter than the lengthL1 of the multilayer ceramic capacitor 100, at the time of mounting thecomposite electronic component on the printed circuit board, the ceramicchip 200 may serve to allow the solder to be applied only up to thelower surfaces of the first and second external electrodes 131 and 132in the length direction of the multilayer ceramic capacitor 100, andprevent the solder from being connected up to the multilayer ceramiccapacitor 100.

Therefore, the transferring of vibrations to the printed circuit boardby the solder may be further decreased.

FIG. 7 is a perspective view schematically illustrating a compositeelectronic component according to another exemplary embodiment in thepresent disclosure.

Referring to FIG. 7, the composite electronic component according toanother exemplary embodiment in the present disclosure may include acomposite body 300′ in which a multilayer ceramic capacitor 100 and aceramic chip 200′ are coupled to each other, the multilayer ceramiccapacitor 100 including a first ceramic body 110 in which a plurality ofdielectric layers and internal electrodes disposed to face each otherwith respective dielectric layers interposed therebetween are stackedand first and second external electrodes 131 and 132 disposed on bothend portions of the first ceramic body 110, and a ceramic chip 200′including a second ceramic body 210′ disposed on a lower portion of themultilayer ceramic capacitor 100 and first and second terminalelectrodes 211′ and 212′ disposed on both end portions of the secondceramic body 210′ and connected to the first and second externalelectrodes 131 and 132, wherein in the ceramic chip 200′, a cut portion250 cut inwardly from both end portions of the ceramic chip 200′ in alength direction is further disposed, and the first and second terminalelectrodes 211′ and 212′ are entirely disposed on both end portions ofthe second ceramic body 210′ in the length direction.

According to another exemplary embodiment in the present disclosure, awidth of the second ceramic body 210′ maybe entirely uniform, and a cutportion 250 cut inwardly from both end portions of the second ceramicbody 210′ in the length direction may be further disposed in the secondceramic body 210′.

The portion 250 cut inwardly from both end portions thereof in thelength direction may be further disposed in the second ceramic body210′, a space capable of being defined as a solder pocket may be formed.

In this case, at the time of mounting the composite electronic componentaccording to another exemplary embodiment in the present disclosure on aprinted circuit board and applying a solder, the solder may be mostlyfilled in the solder pocket, and the residual solder may be applied ontolower surfaces of the first and second external electrodes 131 and 132of the multilayer ceramic capacitor 100 and side surfaces of the firstand second terminal electrodes 211′ and 212′ of the ceramic chip 200′.

Since an amount of the solder applied onto the lower surfaces of thefirst and second external electrodes 131 and 132 of the multilayerceramic capacitor 100 and the side surfaces of the first and secondterminal electrodes 211′ and 212′ of the ceramic chip 200′ is smallerthan that in a structure according to the related art, the transferringof vibrations to the printed circuit board by the solder may besignificantly decreased.

Further, the first and second terminal electrodes 211′ and 212′ may beentirely disposed on both end portions of the second ceramic body 210′in the length direction, such that adhesive force with the externalelectrodes 131 and 132 of the multi layer ceramic capacitor 100 may beimproved.

Hereinafter, a manufacturing process of the composite electroniccomponent according to the exemplary embodiment in the presentdisclosure will be described, but the manufacturing process is notlimited thereto.

In the ceramic chip 200 included in the composite electronic componentaccording to the present disclosure, first, the second ceramic body 210formed of bulk shaped ceramic may be prepared.

The ceramic may contain alumina (Al₂O₃).

In the second ceramic body 210, the second region may have a shape cutin the width direction so that the width of the first regioncorresponding to the region in which the terminal electrodes are formedis wider than that of the second region corresponding to the centralregion in which the terminal electrodes are not formed.

Therefore, the second ceramic body 210 may have an H shape.

Further, the cut portion 250 may be further formed in both end portionsof the second ceramic body 210 in the length direction, in which theterminal electrodes are formed.

The cut portion 250 may be formed in central portions of the secondceramic body 210 in the width direction in both end portions of thesecond ceramic body 210 in the length direction at a predetermined size,but is not necessarily limited thereto.

Due to the shape as described above, the spaces capable of being definedas so-called solder pockets may be formed in the second ceramic body 210in the width and length directions.

According to another exemplary embodiment, the cut portion may be formedin both end portions of the second ceramic body 210′, which has auniform width, in the length direction.

Therefore, the second ceramic body 210′ may have an I shape.

According to the present exemplary embodiment, due to a structural shapeof the I shape itself, a solder pocket may be formed in both endportions of the second ceramic body 210′ in the length direction.

Next, the ceramic chip 200 may be manufactured by forming the terminalelectrodes 211 and 212 on both end portions of the second ceramic body210, and perpendicularly adhered to the multilayer ceramic capacitor 100manufactured in advance.

A coupling method of the ceramic chip 200 and the multilayer ceramiccapacitor 100 may be various, and is not particularly limited.

As an example of the coupling method, a central region of the secondceramic body in which the terminal electrodes are not formed may beapplied with an insulating adhesive such as an epoxy resin, or the like,to thereby be coupled to a region of the first ceramic body 110 on whichthe external electrodes are not formed, and then, a composite body ofthe ceramic chip on which the terminal electrodes are formed and themultilayer ceramic capacitor may be formed by applying a conductivepaste and performing a plating process.

As another example, a high melting point solder or conductive adhesivemay be applied onto regions of the terminal electrodes of the ceramicchip 200 in which the terminal electrodes are formed, thereby couplingthe ceramic chip 200 and the multilayer ceramic capacitor 100 to eachother while contacting the first and second external electrodes 131 and132 of the multilayer ceramic capacitor 100.

Board Having Composite Electronic Component

FIG. 8 is a perspective view illustrating a board in which the compositeelectronic component of FIG. 1 is mounted on a printed circuit board.

FIG. 9 is a cross-sectional view illustrating the board in which thecomposite electronic component of FIG. 8 is mounted on the printedcircuit board, taken in a length direction.

Referring to FIGS. 8 and 9, a board 400 having a composite electroniccomponent according to the present exemplary embodiment may include aprinted circuit board 410 on which the composite electronic component ismounted, and two electrode pads 421 and 422 formed on an upper surfaceof the printed circuit board 410.

The electrode pads 421 and 422 may be composed of first and secondelectrode pads 421 and 422 connected to the first and second terminalelectrodes 211 and 212 of the ceramic chip 200 of the compositeelectronic component, respectively.

In this case, the first and second terminal electrodes 211 and 212 ofthe ceramic chip 200 may be electrically connected to the printedcircuit board 410 by solder 430 in a state in which first and secondterminal electrodes 211 and 212 are positioned to contact the first andsecond electrode pads 421 and 422, respectively.

When a voltage is applied in a state in which the composite electroniccomponent is mounted on the printed circuit board 410 as describedabove, acoustic noise may be generated.

That is, when voltages having different polarities are applied to thefirst and second external electrodes 131 and 132 disposed on both endsurfaces of the multilayer ceramic capacitor 100 of the compositeelectronic component in the length direction in a state in which thecomposite electronic component is mounted on the printed circuit board410, the first ceramic body may be expanded and contracted in athickness direction by an inverse piezoelectric effect of the dielectriclayer 111, and both side portions of the first and second externalelectrodes 131 and 132 may be contracted and expanded by the Poissoneffect, as opposed to expansion and contraction of the first ceramicbody 110 in the thickness direction.

Here, since the composite electronic component according to theexemplary embodiment in the present disclosure is manufactured so thatthe width of the first region 210 a of the second ceramic body 210 inwhich the first and second terminal electrodes 211 and 212 are disposedis wider than the width of the second region (the other region) 210 b ofthe second ceramic body 210, and the width of the second region 210 b ofthe second ceramic body 210 is narrower than the width of the firstceramic body 110 corresponding thereto, even though an amount of solderis large at the time of mounting the composite electronic component onthe printed circuit board, a problem that the solder rises along thefirst and second external electrodes 131 and 132 of the multilayerceramic capacitor 100 may be prevented, thereby blocking piezoelectricstress from being directly transferred from the multilayer ceramiccapacitor 100 to the printed circuit board through the first and secondexternal electrodes 131 and 132. Therefore, acoustic noise may befurther decreased.

That is, at the time of mounting the composite electronic component onthe printed circuit board, the transferring of vibrations of thecapacitor due to the inverse piezoelectric properties of the capacitorto the printed circuit board may be decreased, such that acoustic noisemay be decreased.

As set forth above, according to exemplary embodiments in the presentdisclosure, stress or vibrations due to the piezoelectric property ofthe multilayer ceramic capacitor may be alleviated by the ceramic chip,such that an intensity of the acoustic noise generated in the printedcircuit board may be decreased.

Further, the internal electrodes of the multilayer ceramic capacitor maybe stacked in a direction perpendicular to the mounting surface, and asurface of the multilayer ceramic capacitor in the length-widthdirection, of which a piezoelectric displacement amount is small, may beadhered to the ceramic chip, such that the transferring of stress andvibrations generated in the multilayer ceramic capacitor to the ceramicchip may be significantly decreased, thereby decreasing acoustic noise.

In addition, the cut portion may be formed inwardly from both endportions of the ceramic chip in the width or length direction, and thewidth and length directions, such that formation of the solder in thethickness direction of the multilayer ceramic capacitor may be blocked,and thus, the transferring of vibrations to the printed circuit board bythe solder may be significantly decreased.

Further, the terminal electrodes disposed on the ceramic chip may beentirely disposed on both end portions of the ceramic chip in the lengthdirection, such that adhesive force with the external electrodes of themultilayer ceramic capacitor may be improved.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A composite electronic component comprising: acomposite body in which a multilayer ceramic capacitor and a ceramicchip are coupled to each other; the multilayer ceramic capacitorincluding a first ceramic body in which a plurality of dielectric layersand internal electrodes disposed to face each other with respectivedielectric layers interposed therebetween are stacked, and first andsecond external electrodes disposed on both end portions of the firstceramic body; the ceramic chip including a second ceramic body disposedon a lower portion of the multilayer ceramic capacitor and includingalumina (Al₂O₃), and first and second terminal electrodes disposed onboth end portions of the second ceramic body; a conductive adhesivedisposed between the first and second external electrodes and the firstand second terminal electrodes to connect the first and second externalelectrodes and the first and second terminal electrodes each other; andan insulating adhesive disposed between the first ceramic body and thesecond ceramic body to couple the first ceramic body and the secondceramic body each other, wherein the second ceramic has first regions inwhich the first and second terminal electrodes and a second regionbetween the first regions, and wherein a width of the first regions ofthe second ceramic body is wider than a width of the second region ofthe second ceramic body.
 2. The composite electronic component of claim1, wherein in a cross-section cut perpendicular to a length direction,the width of the second region of the second ceramic body is narrowerthan a width of the first ceramic body.
 3. The composite electroniccomponent of claim 1, wherein the ceramic chip has a cut portion cutinwardly from both end portions of the ceramic chip in a lengthdirection.
 4. The composite electronic component of claim 1, wherein theinternal electrodes are stacked to be perpendicular or horizontal to amounting surface of the composite body.
 5. The composite electroniccomponent of claim 1, wherein the first and second terminal electrodesare entirely disposed on both end portions of the second ceramic body ina length direction.
 6. The composite electronic component of claim 1,wherein a length of the ceramic chip is equal to or shorter than alength of the multilayer ceramic capacitor.
 7. The composite electroniccomponent of claim 1, wherein a length of the ceramic chip is equal toor shorter than a length of the multilayer ceramic capacitor, and isequal to or greater than 0.6 times the length of the multilayer ceramiccapacitor.
 8. A board comprising: a printed circuit board on which aplurality of electrode pads are formed; the composite electroniccomponent of claim 1 mounted on the printed circuit board; and a solderconnecting the electrode pads and the composite electronic component toeach other.
 9. The board of claim 8, wherein the ceramic chip has a cutportion cut inwardly from both end portions of the ceramic chip in alength direction, and the solder fills the cut portion.
 10. The board ofclaim 8, wherein the multilayer ceramic capacitor and the ceramic chipare coupled to each other by another solder disposed between the firstand second external electrodes of the ceramic capacitor and the firstand second terminal electrodes of the ceramic chip, and a meltingtemperature of the solder connecting the electrode pads and thecomposite electronic component is less than a melting temperature of theanother solder coupling the ceramic capacitor and the ceramic chip. 11.A composite electronic component comprising: a composite body in which amultilayer ceramic capacitor and a ceramic chip are coupled to eachother; the multilayer ceramic capacitor including a first ceramic bodyin which a plurality of dielectric layers and internal electrodesdisposed to face each other with respective dielectric layers interposedtherebetween are stacked, and first and second external electrodesdisposed on both end portions of the first ceramic body; the ceramicchip including a second ceramic body disposed on a lower portion of themultilayer ceramic capacitor and including alumina (Al₂O₃), and firstand second terminal electrodes disposed on both end portions of thesecond ceramic body; a conductive adhesive disposed between the firstand second external electrodes and the first and second terminalelectrodes to connect the first and second external electrodes and thefirst and second terminal electrodes each other; and an insulatingadhesive disposed between the first ceramic body and the second ceramicbody to couple the first ceramic body and the second ceramic body eachother, wherein the second ceramic has first regions in which the firstand second terminal electrodes and a second region between the firstregions, and wherein in a cross-section cut perpendicular to a lengthdirection, a width of the second region of the second ceramic body isnarrower than a width of the first ceramic body.
 12. The compositeelectronic component of claim 11, wherein the ceramic chip has a cutportion cut inwardly from both end portions of the ceramic chip in alength direction.
 13. The composite electronic component of claim 11,wherein the internal electrodes are stacked to be perpendicular orhorizontal to a mounting surface of the composite body.
 14. Thecomposite electronic component of claim 11, wherein the first and secondterminal electrodes are entirely disposed on both end portions of thesecond ceramic body in a length direction.
 15. The composite electroniccomponent of claim 11, wherein a length of the ceramic chip is equal toor shorter than a length of the multilayer ceramic capacitor.
 16. Thecomposite electronic component of claim 11, wherein a length of theceramic chip is equal to or shorter than a length of the multilayerceramic capacitor, and is equal to or greater than 0.6 times the lengthof the multilayer ceramic capacitor.
 17. A board comprising: a printedcircuit board on which a plurality of electrode pads are formed; thecomposite electronic component of claim 11 mounted on the printedcircuit board; and a solder connecting the electrode pads and thecomposite electronic component to each other.
 18. The board of claim 17,wherein the ceramic chip has a cut portion cut inwardly from both endportions of the ceramic chip in a length direction, and the solder fillsthe cut portion.
 19. The board of claim 17, wherein the multilayerceramic capacitor and the ceramic chip are coupled to each other byanother solder disposed between the first and second external electrodesof the ceramic capacitor and the first and second terminal electrodes ofthe ceramic chip, and a melting temperature of the solder connecting theelectrode pads and the composite electronic component is less than amelting temperature of the another solder coupling the ceramic capacitorand the ceramic chip.